8 Gbit LPDDR3 for mobile and embedded systems
Packaged in a 178-VFBGA (11.5x11 mm), this part is a surface-mount, tray-shipped component intended for high-volume reflow assembly. The -30°C to 85°C case-temperature range is wider than standard LPDDR3 parts — the -30°C low side covers cold-start scenarios in outdoor handhelds, automotive infotainment (non-AEC), and industrial portable terminals.
Supplier device package is 178-FBGA (11.5x11 mm). 178-ball VFBGA footprint.
