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Microchip Technology ZL40292LDF1 — Discrete Semiconductors

Microchip ZL40292LDF1 Fanout Buffer, 1:20, 250 MHz, 72-QFN

MPNZL40292LDF1
End of Life

Microchip Technology ZL40292LDF1 Fanout Buffer (Distribution), Clock input, HCSL output, 1:20 ratio, 250 MHz max, 3.135V~3.465V supply, -40°C to 85°C, 72-VFQFN Exposed Pad, Tape & Reel.

$6.59Ref. price · indicative, final on quote
Packaging72-VFQFN Exposed Pad
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

ZL40292LDF1 specifications
ParameterValue
TypeFanout Buffer (Distribution)
MountingSurface Mount
Supply voltage3.135V ~ 3.465V
Frequency - max250 MHz
Operating temperature-40°C ~ 85°C (TA)
InputClock
OutputHCSL
PackageTape & Reel (TR); Cut Tape (CT)
Case72-VFQFN Exposed Pad
Number of circuits1
Ratio - Input:Output1:20
Differential - Input:OutputYes/Yes

Product details

1:20 clock fanout with HCSL outputs

The ZL40292LDF1 is a 1:20 fanout buffer from Microchip Technology, designed to distribute a single differential clock input to twenty HCSL (High-Speed Current Steering Logic) outputs. The part handles clock frequencies up to 250 MHz and operates from a 3.135 V to 3.465 V supply rail. The 1:20 ratio means a single clock source fans out to twenty independent HCSL lanes, each capable of driving a 50-ohm terminated transmission line — typical for PCIe reference clocks, SerDes reference distribution, or multi-card backplane timing. The differential input and output paths (Yes/Yes) maintain signal integrity across the fanout tree.

Ultra-low additive jitter and temperature range

The device is described as a buffer with ultra-low additive jitter, which matters when distributing a clean clock to multiple receivers — additive jitter is the noise the buffer itself injects, not the input clock's phase noise. For a 250 MHz reference clock, keeping additive jitter in the sub-picosecond range preserves the timing margin for high-speed serial links.

72-QFN package and board integration

The 72-VFQFN Exposed Pad (10x10 mm body,) provides a central thermal pad for heat sinking to the PCB ground plane. The exposed paddle must be soldered to a copper pour with sufficient vias to the inner layers — without a low-thermal-resistance path, the junction temperature rises above the 85°C ambient limit, especially when all twenty outputs are switching at 250 MHz. The tape-and-reel packaging supports automated pick-and-place; cut-tape samples are also available for prototyping.

No pin-compatible second source is recorded — the fanout ratio and HCSL output type are specific to this Microchip device.

Frequently asked questions

What compliance documentation does Microchip provide for the ZL40292LDF1?

The part is RoHS3 compliant. No REACH, UL, or IEC certification is listed in the available specifications. Standard Microchip documentation includes the datasheet, PCN notifications, and the RoHS declaration of compliance.