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Microchip Technology ZL30110LDF1 — Discrete Semiconductors

Microchip ZL30110LDF1 DPLL, 100MHz, 32-QFN, Telecom

MPNZL30110LDF1
End of Life

Microchip Technology ZL30110LDF1 telecom DPLL, PLL Yes, 100MHz max output, LVCMOS/Crystal input, 2:4 ratio, 32-VFQFN Exposed Pad, -40 to 85°C, ROHS3 compliant.

$14.7Ref. price · indicative, final on quote
Packaging32-VFQFN Exposed Pad
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

ZL30110LDF1 specifications
ParameterValue
MountingSurface Mount
Supply voltage3.1V ~ 3.5V
Frequency - max100MHz
Operating temperature-40°C ~ 85°C
PLLYes
InputLVCMOS, Crystal
OutputLVCMOS
PackageTape & Reel (TR); Cut Tape (CT)
Main purposeTelecom
Case32-VFQFN Exposed Pad
Number of circuits1
Ratio - Input:Output2:4
Differential - Input:OutputNo/No

Product details

What the PLL and 100 MHz ceiling mean for your clock tree

The ZL30110LDF1 is a telecom-grade digital PLL (DPLL) with a 100 MHz maximum output frequency, purpose-built for rate conversion in synchronous networks. The integrated PLL cleans jitter from the reference clock and synthesises a low-phase-noise output at the target frequency, up to 100 MHz. For a line card or base station clock tree, this means one device replaces a discrete VCXO + PLL loop — the DPLL handles both frequency synthesis and wander filtering in the digital domain. The 2:4 input-to-output ratio gives you two reference inputs (LVCMOS or crystal,) that can be switched or held as a primary/backup pair, feeding four LVCMOS clock outputs. Non-differential I/O keeps the routing single-ended — simpler board layout than CML or LVPECL, but the trace impedance and length matching still matter at 100 MHz to avoid reflections.

Package, supply, and temperature — board-fit checklist

The supply rail is 3.1V to 3.5V — a clean 3.3V rail with <50 mV ripple is the typical choice; the DPLL's internal regulator rejects some supply noise, but the VCO's phase noise floor tracks the rail quality. Single-circuit device — one PLL core per package. Surface-mount assembly with MSL level typical for QFN packages; the exposed pad must be soldered to the ground plane for both thermal and electrical reference. The 32-QFN footprint is shared across the ZL3011x family, so a board layout for the sibling parts accepts this device without change.

Active lifecycle and compliance — procurement posture

ROHS3 compliant, which covers the current EU exemption scope for lead-free assembly. The active status means the factory continues to produce the device, so multi-year design support is expected without a forced migration.