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Microchip Technology TC4432EOA713 — Power Management (PMIC / Gate Driver)

Microchip TC4432EOA713 Gate Driver, 1.5A, 8-SOIC

MPNTC4432EOA713
End of Life

Microchip Technology TC4432EOA713 single-channel gate driver, N-Channel P-Channel MOSFET, 1.5A peak output, 8-SOIC surface mount package, Tape & Reel.

$3.86Ref. price · indicative, final on quote
Packaging8-SOIC (0.154", 3.90mm Width)
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

TC4432EOA713 specifications
ParameterValue
Gate typeN-Channel, P-Channel MOSFET
Input typeNon-Inverting
Channel typeSingle
MountingSurface Mount
Supply voltage4.5V ~ 30V
Logic voltage - VIL, VIH0.8V, 2.4V
Current - peak output (Source, sink)1.5A, 1.5A
Operating temperature-40°C ~ 150°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
Case8-SOIC (0.154\", 3.90mm Width)
Number of drivers1
Driven configurationHigh-Side or Low-Side
Rise (Fall time)25ns, 33ns

Product details

What the 1.5A peak output and 25ns rise time mean for your switching stage

The TC4432EOA713 delivers 1.5A peak source and 1.5A peak sink current, with a typical 25ns rise and 33ns fall time driving a 1nF load. That combination means it can charge the gate capacitance of a medium-power MOSFET (say 2-5 nC total gate charge) in under 50 ns — fast enough to keep switching losses in check for a 100-200 kHz SMPS or a motor-drive PWM stage running at 20 kHz. It won't drive a GaN FET or a massive IGBT module, but for the vast majority of TO-220 and D2PAK silicon MOSFETs, this is a solid match. That saves a translator chip and one more trace on the board.

Active lifecycle and what it means for a BOM line

For a procurement team reviewing a BOM for a new design, that means no immediate last-time-buy risk and no forced migration to a successor. The ROHS3 compliance is confirmed, which covers the EU RoHS directive without exemptions. That qualifies it for under-hood or engine-bay electronics, not just cabin or infotainment.

Package and board-fit: 8-SOIC with no thermal pad

There is no exposed thermal pad — the die dissipates through the leadframe and the copper traces. For the 1.5A peak current at a few hundred kHz, the average power dissipation is low enough that a standard SOIC footprint with 1 oz copper pours on the drain pins handles the heat without a dedicated thermal land.

Frequently asked questions

Will TC4432EOA713 drop into a board designed for TC4424EPA?

No — the TC4424EPA is a through-hole DIP-8 part with dual independent 3A drivers, while the TC4432EOA713 is a single-channel 1.5A driver in an 8-SOIC surface-mount package. The pinout is different and the footprint does not match. They are not drop-in interchangeable; a board respin is required.