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Microchip Technology TC1303B-DG0EMF — Power Management (PMIC / Gate Driver)

Microchip TC1303B-DG0EMF Dual Regulator, 2 MHz Buck + LDO

MPNTC1303B-DG0EMF
End of Life

Microchip Technology TC1303B-DG0EMF dual-output power management IC, synchronous buck (3 V, 500 mA) plus LDO (2.7 V, 300 mA), 2 MHz switching, integrated sequencer, 10-DFN (3x3 mm), -40 to 85°C, RoHS3.

$1.82Ref. price · indicative, final on quote
Packaging10-VFDFN Exposed Pad
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

TC1303B-DG0EMF specifications
ParameterValue
MountingSurface Mount
Supply voltage2.7V ~ 5.5V
Voltage/Current - output 13V, 500mA
Voltage/Current - output 22.7V, 300mA
Frequency - switching2MHz
I/O channels2
Operating temperature-40°C ~ 85°C
PackageTube
TopologyStep-Down (Buck) Synchronous (1), Linear (LDO) (1)
W (Sequencer)Yes
W (LED driver)No
W (Supervisor)No
Case10-VFDFN Exposed Pad

Product details

Active dual-rail PMIC for space-constrained designs

The TC1303B-DG0EMF: The integrated power sequencer (w/Sequencer = Yes) ensures the two rails come up in the correct order on power-on, eliminating the need for an external supervisor or reset IC in multi-voltage designs.

What the 2 MHz switching and dual topology mean for your BOM

The 2 MHz switching frequency of the synchronous buck converter lets you use small-value inductors and ceramic output capacitors — typically 1 µH to 4.7 µH and 10 µF MLCCs — keeping the total solution footprint under 30 mm² including passives. The LDO output provides a clean, low-noise rail at 2.7 V / 300 mA for analog or RF sections that cannot tolerate the ripple from a switching regulator — the buck's output feeds the LDO's input internally, so the LDO's PSRR attenuates the switching noise. Operating temperature covers -40°C to 85°C, which is the industrial-grade band — suitable for outdoor telecom, factory-floor sensors, and automotive cabin electronics that see ambient heat but not under-hood extremes.

Package, footprint, and board integration

Housed in a 10-VFDFN with exposed pad (3x3 mm DFN per the supplier device package), the part is surface-mount with a thermal pad underneath that must be soldered to a PCB copper land for adequate heat dissipation — the junction-to-board thermal path goes through this pad. The exposed pad also serves as the ground connection; the datasheet layout recommendation places several thermal vias under the pad to pull heat into the inner-layer ground plane. Supplied in tube packaging, which is the standard antistatic tube for DFN devices — suitable for low-volume assembly or prototyping; for reel packaging check the TC1303B-DG0EMFTR variant.

Frequently asked questions

What is TC1303B-DG0EMF's topology and how many outputs does it have?

It integrates a step-down synchronous buck converter and a linear (LDO) regulator in one package — two outputs total. The buck delivers 3 V at 500 mA, and the LDO delivers 2.7 V at 300 mA. An on-chip power sequencer controls the startup order.