SY10EP51VMG-TR

Microchip Technology · 10EP Series

Microchip Technology 10EP series D-Type flip-flop, SY10EP51VMG-TR, 3 GHz clock frequency, -3V to -5.5V supply, complementary outputs, 8-MLF (2x2 mm) surface mount package.

Microchip Technology SY10EP51VMG-TR
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

SY10EP51VMG-TR specifications
Parameter / AttributeSpecification / Value
TypeD-Type
Series10EP
Output typeComplementary
Trigger typePositive, Negative
MountingSurface Mount
Supply voltage-3V ~ -5.5V
Current - quiescent40 mA
Clock frequency3 GHz
Operating temperature-40°C ~ 85°C (TA)
PackageTape & Reel (TR); Cut Tape (CT)
FunctionReset
Case8-VFDFN Exposed Pad, 8-MLF®
Number of elements1
Number of bits per element1

Technical details

3 GHz D-Type flip-flop for high-speed signal chains

The SY10EP51VMG-TR is a single-bit D-type flip-flop from Microchip's 10EP series, clocked at 3 GHz with complementary outputs. It runs on a -3V to -5.5V supply and draws 40 mA quiescent current — a fit for ECL-based timing paths in test equipment, optical transceivers, or high-speed data acquisition where propagation delay matters more than power budget.

The 3 GHz clock frequency sets the toggle ceiling — at this rate the flip-flop can retime a serial data stream at 3 Gbps with positive or negative edge trigger. The -3V to -5.5V supply is negative-rail ECL, not standard 3.3V or 5V logic; your design needs a dedicated negative supply rail or a level translator at the I/O boundary. Complementary outputs (Q and Q-bar) eliminate the need for an external inverter in differential signal paths. The reset function forces Q low on assertion, useful for initialization sequences in counter or state-machine chains.

Available in tape and reel or cut tape — the TR suffix indicates reel packaging for automated pick-and-place. No special handling beyond standard ESD precautions for a 3 GHz part; the small 2x2 mm body means tweezers or a vacuum pencil for rework, not a hot-air station unless the adjacent components are low-density.

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