PIC18F46K80-I/ML

Microchip Technology · PIC® XLP™ 18K Series

Microchip PIC® XLP™ 18K series PIC18F46K80-I/ML, 8-bit MCU, 64MHz, 64KB Flash, 3.6K x 8 RAM, 1K x 8 EEPROM, 35 I/O, ECANbus/I2C/SPI/LIN/UART, 1.8V-5.5V, -40°C to 85°C, 44-QFN.

Microchip Technology PIC18F46K80-I/ML
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Technical specifications

PIC18F46K80-I/ML specifications
Parameter / AttributeSpecification / Value
SeriesPIC® XLP™ 18K
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 5.5V
Operating temperature-40°C ~ 85°C (TA)
Speed64MHz
PackageTube
RAM size3.6K x 8
Core size8-Bit
EEPROM size1K x 8
PeripheralsBrown-out Detect/Reset, LVD, POR, PWM, WDT
ConnectivityECANbus, I2C, LINbus, SPI, UART/USART
Number of i (O)35
Core processorPIC
Case44-VQFN Exposed Pad
Data convertersA/D 11x12b
Program memory size64KB (32K x 16)

Technical details

It integrates an ECANbus controller (CAN 2.0B), along with I2C, SPI, LINbus, and two UART/USART modules — a peripheral set that targets distributed control nodes in industrial automation, building management, and automotive body electronics (non-safety). With 35 I/O lines and an 11-channel 12-bit ADC, it can handle a mix of digital sensors, relay drivers, and analog feedback in a single package.

Industrial temperature and 44-QFN — board-level fit

The 44-QFN package (8x8 mm) with an exposed pad needs a good thermal via stitch under the pad if the MCU drives more than a few hundred milliamps through its I/O pins — the die's junction-to-ambient thermal resistance benefits from a copper pour on the bottom layer.

The part is ROHS3 compliant.

PIC18F46K80-I/ML
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