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Microchip Technology PIC18F26K20-I/SP — Microcontrollers & Processors (MCU / MPU / DSP)

PIC18F26K20-I/SP Microchip 8-bit MCU, 64 MHz, 64 KB Flash

MPNPIC18F26K20-I/SP
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Microchip PIC® XLP™ 18K series PIC18F26K20-I/SP, 8-bit MCU, 64 MHz, 64 KB Flash, 3.8 KB RAM, 1 KB EEPROM, 24 I/O, 11x10b ADC, I²C/SPI/UART, 1.8V-3.6V, -40°C to 85°C, 28-SPDIP.

$3.7400Ref. price · indicative, final on quote
Packaging28-DIP (0.300", 7.62mm)
RoHSROHS3 Compliant
SeriesPIC® XLP™ 18K
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

PIC18F26K20-I/SP specifications
ParameterValue
SeriesPIC® XLP™ 18K
MountingThrough Hole
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed64MHz
PackageTube
RAM size3.8K x 8
Core size8-Bit
EEPROM size1K x 8
PeripheralsBrown-out Detect/Reset, HLVD, POR, PWM, WDT
ConnectivityI²C, SPI, UART/USART
Number of i (O)24
Core processorPIC
Case28-DIP (0.300\", 7.62mm)
Data convertersA/D 11x10b
Program memory size64KB (32K x 16)

Product details

64 MHz 8-bit core in a DIP — what this PIC brings to the board

It packs 24 general-purpose I/O lines, an 11-channel 10-bit ADC, and serial connectivity (I²C, SPI, UART/USART) into a 28-pin SPDIP through-hole package.

Memory and peripheral mix — sizing the BOM fit

64 KB of Flash (32K x 16) gives room for moderate-complexity firmware — motor control loops, sensor fusion, or communication stacks. The 1 KB EEPROM is useful for calibration constants and configuration that survive a firmware update — no external serial EEPROM needed for that data. On the peripheral side you get a 10-bit ADC with 11 channels, hardware PWM, brown-out detect, and a watchdog timer — enough to run a closed-loop fan controller, a basic power supply supervisor, or a keypad interface without external glue logic.

Through-hole package — design-in and sourcing angle

The 28-SPDIP (0.300" wide, 7.62 mm pitch) is the through-hole variant. It fits standard 28-pin DIP sockets and breadboards, which makes it a first-choice for development boards, low-volume production, or environments where vibration resistance from a soldered through-hole joint matters. The surface-mount sibling PIC18F26K20-I/SS (SOIC-28) shares the same die and firmware — the only difference is the footprint.

Frequently asked questions

What is the difference between PIC18F26K20-I/SP and PIC18F26K20-I/SS?

The two share the same die, firmware, and electrical characteristics. The -I/SP is the 28-SPDIP through-hole package; the -I/SS is the SOIC-28 surface-mount package. Choose the -I/SP for breadboard prototyping, socketed designs, or hand-assembly.