PIC16F676-I/P

Microchip Technology · PIC® 16F Series

Microchip PIC® 16F PIC16F676-I/P, 8-bit MCU, 20MHz, 1.75KB Flash, 64 x 8 RAM, 128 x 8 EEPROM, 12 I/O, 8x10b ADC, -40°C to 85°C, 14-DIP through-hole.

Microchip Technology PIC16F676-I/P
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[IN STOCK] In Stock: 18 pcs
$2.87/ pc

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Technical specifications

PIC16F676-I/P specifications
Parameter / AttributeSpecification / Value
SeriesPIC® 16F
MountingThrough Hole
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2V ~ 5.5V
Operating temperature-40°C~85°C(TA)
Speed20MHz
PackageTube
RAM size64 x 8
Core size8-Bit
EEPROM size128 x 8
PeripheralsBrown-out Detect/Reset, POR, WDT
Number of i (O)12
Core processorPIC
Case14-DIP (0.300\", 7.62mm)
Data convertersA/D 8x10b
Program memory size1.75KB (1K x 14)

Technical details

20 MHz 8-bit core in a 14-pin DIP — what it handles

The Microchip PIC16F676-I/P is an 8-bit PIC MCU running at 20 MHz, with 1.75 KB (1K x 14) Flash program memory, 64 bytes of RAM, and 128 bytes of EEPROM. This is a part sized for simple control loops — sensor readout, switch debounce, PWM generation — not for data-logging or communication stacks.

Memory budget — plan the firmware around 1.75 KB

With 1.75 KB of Flash and 64 bytes of RAM, the firmware must be lean. The 128 bytes of EEPROM are useful for calibration constants or configuration that survive power cycles, but there is no room for a bootloader or field-update staging area. The 20 MHz clock yields a 200 ns instruction cycle (4 clocks per instruction on PIC), which is enough for a 10 kHz control loop with the ADC reading one channel per cycle.

Industrial temperature range, through-hole package

The 14-DIP (0.300" body) is through-hole — easy to hand-solder, socket for prototyping, and more tolerant of thermal cycling than a fine-pitch SMD.

Microchip lists this part as Active. For a production BOM, this means no forced redesign cycle from the manufacturer's side.

PIC16F676-I/P
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