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Microchip Technology PIC16F1615-I/P — Microcontrollers & Processors (MCU / MPU / DSP)

Microchip PIC16F1615-I/P 8-bit MCU, 32MHz, 14KB Flash

MPNPIC16F1615-I/P
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Microchip PIC® XLP™ 16F series, PIC16F1615-I/P, 8-bit MCU, 32MHz, 14KB Flash, 1K x 8 RAM, 12 I/O, I²C/SPI/UART/LIN, 8x10b ADC, 1x8b DAC, 2.3V-5.5V, -40°C to 85°C, 14-DIP.

$1.8900Ref. price · indicative, final on quote
Packaging14-DIP (0.300", 7.62mm)
RoHSROHS3 Compliant
SeriesPIC® XLP™ 16F, Functional Safety (FuSa)
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

PIC16F1615-I/P specifications
ParameterValue
SeriesPIC® XLP™ 16F, Functional Safety (FuSa)
MountingThrough Hole
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2.3V ~ 5.5V
Operating temperature-40°C~85°C(TA)
Speed32MHz
PackageTube
RAM size1K x 8
Core size8-Bit
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivityI²C, LINbus, SPI, UART/USART
Number of i (O)12
Core processorPIC
Case14-DIP (0.300\", 7.62mm)
Data convertersA/D 8x10b; D/A 1x8b
Program memory size14KB (8K x 14)

Product details

8-bit control core for embedded sensing and actuation

The Microchip PIC16F1615-I/P is an 8-bit PIC® MCU built on the eXtreme Low Power (XLP) platform with a 32MHz internal oscillator, 14KB Flash program memory, and 1K x 8 bytes of RAM. It is designed for cost-sensitive, moderate-complexity control applications — motor commutation, sensor polling, LIN-bus node communication, and simple human-machine interfaces — where the wide 2.3V to 5.5V supply range allows direct connection to either 3.3V or 5V peripheral rails without a level shifter.

Integrated analog and serial interfaces

On-chip data converters include an 8-channel 10-bit ADC and a single 8-bit DAC, sufficient for reading thermistors, potentiometers, or current-sense resistors and generating an analog output or reference. The 12 general-purpose I/O pins in the 14-DIP package leave a few spare for local LEDs or pushbuttons after allocating the serial and analog channels.

Industrial temperature rating and operating envelope

The 2.3V minimum supply ensures the MCU keeps running through a 3.3V rail dip during a cold-crank event on a vehicle's 12V bus, provided the regulator holds above that threshold.

For new designs, this removes the supply-risk flag that an NRND or EOL part would raise. The through-hole 14-PDIP package is a mature, widely stocked form factor that independent distributors like ours source across multiple date-code lots to support both prototype builds and production-run replenishment.

Through-hole package — board-level fit

The 14-DIP (0.300", 7.62mm) package with through-hole mounting suits prototype boards, low-volume production, and rework-friendly assemblies where a surface-mount QFN or SOIC would complicate manual soldering or field repair. The 14-PDIP body fits standard 0.3" wide sockets, making it straightforward to swap during development or service. For a production line that prefers SMT, the same MCU core is available in SOIC-14 and QFN-16 packages under the PIC16F1615 base number.

Frequently asked questions

What are the closest alternatives to PIC16F1615-I/P?

Within the same PIC® XLP™ 16F family, the PIC16LF1559-I/SS runs at the same 32MHz core speed but offers 17 I/O and a 1.8V minimum supply in an SOIC-20 surface-mount package — useful if the design needs more GPIO or a lower voltage rail. For a 16-bit step up, the PIC24FV16KA304-I/PT provides 16-bit data path, more memory, and a 12-bit ADC in a 44-pin TQFP, though at a higher pin count and cost tier. Neither is a drop-in replacement; the 14-DIP footprint of the PIC16F1615-I/P is unique to this package variant.