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Microchip Technology MMP4402-GM2 — Discrete Semiconductors

Microchip MMP4402-GM2 PIN Diode, 500V, 0.5pF, 0805

MPNMMP4402-GM2
End of Life

Microchip Technology MMP4400 series PIN diode, single, 0805 (2012 Metric) package, Tape & Reel (TR), 500 V peak reverse, 0.5 pF capacitance, 650 mOhm resistance.

$5.0Ref. price · indicative, final on quote
Packaging0805 (2012 Metric)
RoHSROHS3 Compliant
SeriesMMP4400
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MMP4402-GM2 specifications
ParameterValue
SeriesMMP4400
Diode typePIN - Single
Voltage - peak reverse500V
Power dissipation4 W
Operating temperature-55°C ~ 150°C
PackageTape & Reel (TR)
Case0805 (2012 Metric)
Resistance @ if,650mOhm @ 100mA, 100MHz
Capacitance @ vr,0.5pF @ 50V, 1MHz

Product details

PIN diode parametrics for RF switching and attenuation

The MMP4402-GM2 is a single PIN diode from Microchip Technology's MMP4400 series, housed in an 0805 (2012 Metric) surface-mount package. It is designed for RF switching, attenuator, and limiter circuits where low capacitance and low series resistance are critical to maintaining signal integrity through the band. With a peak reverse voltage rating of 500 V, this diode can handle high-voltage RF environments such as transmit/receive switch networks in base stations or radar front-ends. The 0.5 pF capacitance at 50 V reverse bias and 1 MHz sets the off-state isolation — lower capacitance means better isolation at higher frequencies, which is the primary selection axis for a PIN diode in a shunt switch topology. Forward resistance is 650 mOhm at 100 mA forward current and 100 MHz. This figure determines the insertion loss when the diode is forward-biased (on state); a lower resistance reduces the signal loss through the switch. For a typical 50-ohm system, 650 mOhm contributes roughly 0.11 dB of additional loss — well within the budget for most RF chains.

Thermal and package constraints for board integration

The 0805 package footprint is the primary layout constraint — the copper pad area under the terminations sets the thermal resistance to the board. Maximum power dissipation is 4 W, but this is the absolute limit at 25 °C case temperature; in practice, the continuous RF power the diode can handle is derated by the board's ability to sink heat. For a 50-ohm system at 1 GHz, the thermal limit typically becomes relevant above +30 dBm continuous wave input power. The 150 °C upper limit is the junction temperature — the board temperature at the solder joint must stay lower to keep the junction within rating.

Active lifecycle and compliance status

The 0805 package is a standard EIA footprint, so no special nozzle or feeder setup is required beyond the usual 0805 profile.

Frequently asked questions

What compliance documentation does Microchip Technology provide for MMP4402-GM2?

The MMP4402-GM2 is ROHS3 compliant, meeting the EU Restriction of Hazardous Substances directive.