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Microchip Technology MIC39102YM-TR — Power Management (PMIC / Gate Driver)

MIC39102YM-TR Adjustable LDO, 1A, 8-SOIC, Active

MPNMIC39102YM-TR
End of Life

Microchip Technology MIC39102YM-TR adjustable positive LDO regulator, 1A output, 0.63V dropout at 1A max, 16V input max, 8-SOIC surface-mount package, Tape & Reel.

$2.2Ref. price · indicative, final on quote
Packaging8-SOIC (0.154", 3.90mm Width)
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MIC39102YM-TR specifications
ParameterValue
Output typeAdjustable
MountingSurface Mount
Voltage - input16V
Voltage dropout0.63V @ 1A
Voltage - output16V
Voltage - output (Min (Fixed))1.24V
Output current1A
Operating temperature-40°C ~ 125°C
PackageTape & Reel (TR); Cut Tape (CT)
Case8-SOIC (0.154\", 3.90mm Width)
Control featuresEnable
Protection featuresOver Current, Over Temperature, Reverse Polarity
Number of regulators1
Output configurationPositive

Product details

1A adjustable LDO — what the dropout tells you

The MIC39102YM-TR is a 1A adjustable positive LDO from Microchip Technology, in an 8-SOIC surface-mount package. Its 0.63V maximum dropout at the full 1A load means the input rail needs to stay at least that much above the set output voltage to keep regulation — a 3.3V output from a 5V rail gives 1.07V headroom, which is comfortable, but a 4.5V rail would be marginal at high current. Output is adjustable from a 1.24V reference up to the 16V input maximum, set by an external resistor divider. The enable pin lets a logic signal shut the regulator down, pulling the output to zero and dropping quiescent current to near zero.

Protection set and temperature range

On-chip protection covers overcurrent, overtemperature, and reverse polarity — the reverse polarity clamp means the regulator survives a reversed input without an external Schottky diode across the input, saving a component and a voltage drop. The 8-SOIC package (0.154" wide, 3.90mm body) is a standard footprint that reflows on a standard SOIC-8 land pattern. The thermal pad is the die-attach paddle on the bottom — for 1A continuous at elevated ambient, the PCB copper area under the package becomes the primary heatsink; a 1-square-inch pour on the top layer keeps the junction below 125°C at 25°C ambient.