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Microchip Technology MCP8024-H/MP — Discrete Semiconductors

MCP8024-H/MP BLDC Pre-Driver, 6-28V, 40QFN

MPNMCP8024-H/MP
End of Life

Microchip Technology MCP8024-H/MP BLDC motor pre-driver, Controller - Commutation & Direction Management, PWM interface, Power MOSFET technology, 6V~28V supply, 40-VFQFN Exposed Pad, Tube.

$3.14Ref. price · indicative, final on quote
Packaging40-VFQFN Exposed Pad
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MCP8024-H/MP specifications
ParameterValue
MountingSurface Mount
Motor type - AC, DCBrushless DC (BLDC)
Supply voltage6V ~ 28V
InterfacePWM
Operating temperature-40°C ~ 150°C (TA)
PackageTube
FunctionController - Commutation, Direction Management
TechnologyPower MOSFET
ApplicationsGeneral Purpose
Case40-VFQFN Exposed Pad
Output configurationPre-Driver - Half Bridge (3)

Product details

BLDC pre-driver with integrated commutation logic

The MCP8024-H/MP is a three-phase brushless DC (BLDC) motor pre-driver from Microchip Technology, combining commutation and direction management logic with a half-bridge gate-drive output stage. It accepts a 6 V to 28 V supply and drives external power MOSFETs in a half-bridge configuration (three outputs) for sensorless or sensored BLDC commutation. The PWM interface allows the host controller to set duty cycle and commutation timing directly, while the on-chip control logic handles the six-step sequence and direction reversal. This offloads real-time commutation from the MCU, freeing cycles for higher-level motor control algorithms.

Rated for a 6 V to 28 V supply, the part covers the common 12 V and 24 V industrial bus voltages used in pumps, fans, and conveyor drives. The -40°C low end handles cold-start conditions in outdoor or unheated enclosures, while the 150°C ceiling provides margin above the typical 85°C or 105°C industrial ambient — useful when the pre-driver is mounted near the motor or in a confined panel.

Housed in a 40-VFQFN with exposed pad (5x5 mm body), the MCP8024-H/MP requires a thermal land on the PCB to conduct heat from the die to the board. The exposed pad is the primary thermal path — the datasheet's recommended footprint includes a 3.3x3.3 mm solder pad with via array to the ground plane. Supplied in tube, not tape-and-reel — factor this into the pick-and-place setup if the line is configured for reel-fed parts only.

Frequently asked questions

What is the MCP8024-H/MP's function and how is it used?

It is a BLDC motor pre-driver with integrated commutation and direction management. It takes a PWM input from the host MCU and drives external power MOSFETs in a three-phase half-bridge configuration, handling the commutation sequence and direction logic internally.