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Microchip Technology MCP6D11T-E/MG — Memory (DRAM / SRAM / Flash / EEPROM)

Microchip MCP6D11T-E/MG Differential Op-Amp, 90 MHz, 25 V/µs

MPNMCP6D11T-E/MG
End of Life

Microchip MCP6D11T-E/MG, differential op-amp, 1 circuit, 90 MHz gain bandwidth, 25 V/µs slew rate, rail-to-rail output, 2.5 V to 5.5 V supply, -40°C to 125°C, 16-QFN (3x3 mm).

$1.66Ref. price · indicative, final on quote
Packaging16-VFQFN Exposed Pad
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

MCP6D11T-E/MG Technical Specifications
ParameterValue
Output typeRail-to-Rail
Mounting typeSurface Mount
Amplifier typeDifferential
Voltage - supply span5.5 V
Current - supply1.4mA
Operating temperature-40°C ~ 125°C
Gain bandwidth product90 MHz
PackageTape & Reel (TR); Cut Tape (CT)
Slew rate25V/µs
Case16-VFQFN Exposed Pad
Number of circuits1

Product details

What this differential amplifier brings to the signal chain

The Microchip MCP6D11T-E/MG is a single-channel differential op-amp with a 90 MHz gain-bandwidth product and a 25 V/µs slew rate, designed for applications that need to amplify a differential signal while rejecting common-mode noise.

The 90 MHz gain-bandwidth product sets the usable small-signal bandwidth. For a gain of 10, you get about 9 MHz of closed-loop bandwidth — enough for high-speed data acquisition, video line drivers, or fast sensor interfaces. The 25 V/µs slew rate handles large-signal swings without distortion; a 2 Vpp output step slews in about 80 ns, so this part can drive twisted-pair or coaxial cable in differential signalling schemes without rounding off the edges.

Package and thermal handling: 16-QFN with exposed pad

The MCP6D11T-E/MG comes in a 16-lead QFN measuring 3x3 mm with an exposed thermal pad. That pad needs a via stitch to the ground plane to pull heat out of the die — without it, junction temperature climbs fast above 85°C ambient. The package is hand-solderable with a hot-air station if you're careful, but a reflow profile is cleaner.

Lifecycle and compliance

The extended temperature range and small footprint make it a solid choice for industrial sensor modules and telecom line cards where a second-source is not critical but supply continuity is.

Frequently asked questions

What is the MCP6D11T-E/MG datasheet?

Engineers need the datasheet to validate electrical specs and pinout for circuit design.

Where can I buy MCP6D11T-E/MG?

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What is the price of MCP6D11T-E/MG?

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Is MCP6D11T-E/MG obsolete or active?

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What is the MCP6D11T-E/MG replacement or equivalent?

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What is the MCP6D11T-E/MG pinout?

Design engineers need pin mapping to match footprint and avoid PCB layout errors.