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Microchip Technology MCP2021-330E/SN — Discrete Semiconductors

MCP2021-330E/SN LIN Transceiver, Half-Duplex, 6-18V, 8-SOIC

MPNMCP2021-330E/SN
End of Life

Microchip Technology MCP2021-330E/SN LINbus transceiver, half-duplex, 1/1 driver/receiver, 6V to 18V supply, 175 mV receiver hysteresis, -40°C to 125°C, 8-SOIC surface mount package.

$1.92Ref. price · indicative, final on quote
Packaging8-SOIC (0.154", 3.90mm Width)
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MCP2021-330E/SN specifications
ParameterValue
TypeTransceiver
MountingSurface Mount
Supply voltage6V ~ 18V
ProtocolLINbus
Operating temperature-40°C ~ 125°C
DuplexHalf
PackageTube
Case8-SOIC (0.154\", 3.90mm Width)
Receiver hysteresis175 mV
Number of drivers (Receivers)1/1

Product details

LINbus physical-layer interface for 12V automotive body electronics

The MCP2021-330E/SN is a half-duplex LINbus transceiver in an 8-SOIC package, designed to handle the 6V to 18V supply rail typical of automotive body-control modules — door locks, window lifts, seat adjusters, and lighting nodes that share a single-wire LIN bus. With a single driver/receiver pair (1/1) and a 175 mV receiver hysteresis, it rejects noise on the bus line without needing external filtering for most in-cabin harness runs. The -40°C to 125°C operating range covers the under-hood and cabin temperature extremes, so it fits both engine-bay and interior LIN clusters.

Supply voltage and receiver margin

The 6V to 18V supply range means the transceiver stays alive through a cold-crank dip to 6V and still communicates — the 175 mV hysteresis ensures the bus state is latched cleanly even when the supply sags. Half-duplex operation is standard for LIN: the bus is a single-wire master-slave topology, and the transceiver's own driver disables during reception to avoid loopback.

ROHS3 compliant per the lifecycle record, which satisfies the material restriction requirements for EU and most global markets.

The tube packaging is typical for prototype and low-volume builds; for reel quantities the ordering code differs, so confirm the packaging preference at RFQ.

Frequently asked questions

Is MCP2021-330E/SN compatible with MCP2022-500E/P?

The MCP2022-500E/P is a through-hole (DIP) version of the same LIN transceiver core — same half-duplex LINbus protocol, same 175 mV hysteresis, same 1/1 driver/receiver count. The MCP2021-330E/SN is the surface-mount 8-SOIC variant; they are not pin-compatible without a board change.