4-VLGA footprint and board integration
The DSC6111JE2B-025.0000T: Surface-mount assembly follows standard reflow profiles for ceramic LGA packages — no special bake-out required for MSL-rated MEMS devices.

Microchip Technology DSC61XXB series MEMS XO (Standard), 25 MHz, CMOS output, ±25 ppm, 1.71V-3.63V supply, AEC-Q100, 4-VLGA package, Tape & Reel.
| Parameter | Value |
|---|---|
| Type | XO (Standard) |
| Series | DSC61XXB |
| Mounting | Surface Mount |
| Supply voltage | 1.71V ~ 3.63V |
| Current - supply | 3mA (Typ) |
| Current - supply (Disable) | 1.5µA (Typ) |
| Frequency | 25 MHz |
| Frequency stability | ±25ppm |
| Operating temperature | -20°C ~ 70°C |
| Size (Dimension) | 0.098\" L x 0.079\" W (2.50mm x 2.00mm) |
| Height - seated | 0.035\" (0.89mm) |
| Output | CMOS |
| Package | Tape & Reel (TR) |
| Ratings | AEC-Q100 |
| Function | Standby (Power Down) |
| Base resonator | MEMS |
| Case | 4-VLGA |
The DSC6111JE2B-025.0000T: Surface-mount assembly follows standard reflow profiles for ceramic LGA packages — no special bake-out required for MSL-rated MEMS devices.
The output is CMOS, which is the standard logic-level interface for most digital loads such as MCUs, FPGAs, and SoCs.
The part carries AEC-Q100 automotive qualification. RoHS and REACH compliance documentation is typically available from Microchip Technology for this series.