Package and board integration
The DSC6101JI3B-439K000: Surface-mount assembly with the VLGA's exposed pad requires a via-in-pad layout for thermal relief — the datasheet's recommended stencil aperture is 50% coverage to avoid solder voids under the die attach pad.
Listed as Active — Microchip continues to manufacture the DSC61XXB series with no announced EOL or PCN. The base product number DSC6101 covers the 439 kHz variant; the suffix JI3B encodes the temperature grade (-40 to 85°C), stability (±20 ppm), and package (4-VLGA).
