Frequency stability and temperature envelope
The DSC6101JE3B-485K000T: Packaged on Tape & Reel (TR), it is ready for high-volume pick-and-place; the 4-VLGA footprint has no exposed pad, so the standard solder paste stencil and reflow profile for VLGA packages apply.
Active production — sourcing posture
No stock-holding claim; sourced per request.
