The DSC6101CI1A-026.0000: The MEMS structure holds tighter long-term stability across thermal shock and board flex.
The 26 MHz output is a common multiple for 100BASE-T and automotive 10BASE-T1S.
Supplied in tube packaging, the part is suited for hand-assembly or low-volume prototyping. For reflow, the MEMS die's silicon substrate handles standard lead-free profiles with a peak temperature of 260°C — no moisture-sensitivity level bake is required if the tube is stored in a dry environment.
Sourced through authorized and independent distribution channels; pricing and lead time are confirmed at RFQ against the BOM quantity.