Package and board integration
The DSC6013HI2B-012.0000T: Surface-mount tape-and-reel packaging supports automated pick-and-place assembly; the small footprint means the layout engineer should verify pad geometry against the Microchip application note for MEMS oscillators to avoid solder-joint stress.
AEC-Q100 qualification is the key compliance signal for automotive BOMs; the datasheet also covers RoHS/REACH status per Microchip's standard documentation package.
