2.0mm x 1.6mm 4-VFLGA package and board integration
The DSC6011MI2B-012.0000: Surface-mount assembly with the 4-VFLGA package is straightforward for standard reflow profiles; no special underfill or cavity is required for the MEMS die.

Microchip Technology DSC60XXB series XO (Standard), MEMS-based, 12 MHz, CMOS output, ±25 ppm, 1.8V~3.3V supply, 4-VFLGA package, AEC-Q100.
| Parameter | Value |
|---|---|
| Type | XO (Standard) |
| Series | DSC60XXB |
| Mounting | Surface Mount |
| Supply voltage | 1.8V ~ 3.3V |
| Current - supply | 1.3mA (Typ) |
| Current - supply (Disable) | 1.5µA (Typ) |
| Frequency | 12 MHz |
| Frequency stability | ±25ppm |
| Operating temperature | -40°C~85°C |
| Size (Dimension) | 0.079\" L x 0.063\" W (2.00mm x 1.60mm) |
| Height - seated | 0.035\" (0.89mm) |
| Output | CMOS |
| Package | Bag |
| Ratings | AEC-Q100 |
| Function | Standby (Power Down) |
| Base resonator | MEMS |
| Case | 4-VFLGA |
The DSC6011MI2B-012.0000: Surface-mount assembly with the 4-VFLGA package is straightforward for standard reflow profiles; no special underfill or cavity is required for the MEMS die.
The DSC60XXB series includes multiple frequency and stability variants in the same 4-VFLGA footprint. A pin-compatible alternative with the same supply range and output type is the DSC6011MI2B-012.0000's sibling in the series; confirm the exact frequency and stability grade for your BOM position.