MEMS XO with four independent outputs
Supply range and stability for mixed-voltage boards
Housed in a VFQFN with exposed pad (5.00 mm × 3.20 mm, 0.90 mm height), the thermal pad under the package needs a via array to the ground plane for proper heat sinking. The pad also serves as the only GND connection — ensure the solder paste coverage is even to avoid tilting during reflow. Rework with hot air is straightforward if the board has adequate via thermal relief — the MEMS die is less sensitive to reflow profile than a quartz crystal.
