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Microchip Technology DSC400-0202Q0108KE1 — Crystals & Oscillators

DSC400-0202Q0108KE1 – Microchip MEMS XO, LVPECL

MPNDSC400-0202Q0108KE1
Active

Microchip Technology DSC400 series, XO (Standard) MEMS oscillator, dual LVPECL outputs 167.1875 MHz & 173.28125 MHz, ±50 ppm stability, 2.25–3.6 V supply, 20-VFQFN exposed pad package.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

DSC400-0202Q0108KE1 specifications
ParameterValue
TypeXO (Standard)
SeriesDSC400
Voltage2.25V ~ 3.6V
Frequency stability±50ppm
Frequency - output 1167.1875MHz
Frequency - output 2173.28125MHz
Operating temperature-20°C~70°C
Height0.035\" (0.90mm)
Size (Dimension)0.197\" L x 0.126\" W (5.00mm x 3.20mm)
OutputLVPECL
PackageTube
FunctionEnable/Disable
Base resonatorMEMS
Case20-VFQFN Exposed Pad

Product details

Dual LVPECL outputs at 167.1875 / 173.28125 MHz

The DSC400-0202Q0108KE1 delivers two LVPECL clock outputs: one at 167.1875 MHz and one at 173.28125 MHz, from a single MEMS resonator. These frequencies are common reference clocks for 10G Ethernet PHYs and high-speed SerDes transceivers — the 167.1875 MHz output often feeds the MAC side while the 173.28125 MHz drives the line-side PLL.

Supply flexibility and enable control

The supply voltage range spans 2.25 V to 3.6 V, covering both 2.5 V and 3.3 V rails. This means you can power it from an existing 3.3 V FPGA bank or a 2.5 V SerDes rail without a dedicated LDO — the oscillator's internal regulation handles the variation. When disabled, the outputs enter a high-impedance state, which is useful for sharing a clock bus or for boundary-scan testing.

Active production, sourced per RFQ

Frequently asked questions

What is the output frequency of DSC400-0202Q0108KE1?

It provides two LVPECL outputs: 167.1875 MHz on Output 1 and 173.28125 MHz on Output 2.

What package does DSC400-0202Q0108KE1 come in?

It is supplied in a 20-VFQFN exposed pad package measuring 5.00 mm x 3.20 mm with a 0.90 mm height. The exposed pad must be soldered to a ground plane for thermal and electrical performance.