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Microchip Technology DSC2011FE1-E0005 — Crystals & Oscillators

DSC2011FE1-E0005 MEMS XO – Dual 25 MHz CMOS, Active

MPNDSC2011FE1-E0005
Active

Microchip Technology DSC2011FE1-E0005, XO (Standard), dual 25 MHz CMOS outputs, MEMS resonator, ±50 ppm stability, 2.25 V to 3.6 V supply, 14-VFQFN exposed pad package.

Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

DSC2011FE1-E0005 specifications
ParameterValue
TypeXO (Standard)
SeriesDSC2011
Supply voltage2.25V ~ 3.6V
Current - supply32mA (Typ)
Current - supply (Disable)23 mA
Frequency stability±50ppm
Frequency - output 125MHz
Frequency - output 225MHz
Operating temperature-20°C ~ 70°C
Height0.035\" (0.90mm)
Size (Dimension)0.126\" L x 0.098\" W (3.20mm x 2.50mm)
OutputCMOS
PackageTube
FunctionEnable/Disable
Base resonatorMEMS
Case14-VFQFN Exposed Pad

Product details

Dual 25 MHz MEMS oscillator — one part, two clock trees

The MEMS resonator eliminates quartz aging drift and cuts start-up time to microseconds — a practical advantage for production test where every millisecond of settle time adds up across thousands of boards.

±50 ppm stability over commercial temperature range

Frequency stability is ±50 ppm across the -20 °C to +70 °C operating range — tight enough for 10/100 Ethernet reference clocks and USB full-speed without external trim capacitors.

Enable/Disable function and disable current

No last-time-buy window to track.

14-VFQFN exposed pad — thermal via array required

The pad is electrically connected to ground — the via pattern also provides a low-inductance return path for the CMOS outputs.

Frequently asked questions

What is the frequency stability of the DSC2011FE1-E0005?

±50 ppm over the -20 °C to +70 °C operating range.

What is the output frequency of the DSC2011FE1-E0005?

Both outputs are 25 MHz.

How to solder a 14-VFQFN exposed pad oscillator?

Use a stencil with aperture matching the exposed pad. Apply solder paste to the pad; place the part; reflow per the solder paste profile. Confirm the pad is connected to ground plane for thermal and electrical return.