100 MHz LVPECL MEMS XO — industrial temperature, active production
Supply range and output drive — what the 2.25–3.6 V rail means for the board
6-SMD no-lead package — footprint and layout fit
Housed in a 6-SMD no-lead package measuring 5.00 mm x 3.20 mm with a seated height of 0.90 mm max. The no-lead (QFN-style) footprint provides a low-inductance ground connection under the device, which is important for maintaining signal integrity on the 100 MHz LVPECL edges. Surface-mount assembly follows standard reflow profiles for QFN packages; no special baking is required unless the moisture-sensitive level demands it.
Microchip lists the DSC1122BI2-100.0000 as Active. No last-time-buy window to track — the BOM line can be treated as a standard active component.
