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Microchip Technology DSC1121AM1-050.0000 — Crystals & Oscillators

DSC1121AM1-050.0000 MEMS Oscillator

MPNDSC1121AM1-050.0000
Active

Microchip Technology DSC1121AM1-050.0000, XO (Standard) MEMS oscillator, 50 MHz CMOS output, ±50 ppm stability, AEC-Q100 qualified, -55°C to 125°C, 6-SMD package.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

DSC1121AM1-050.0000 specifications
ParameterValue
TypeXO (Standard)
SeriesDSC1121
MountingSurface Mount
Voltage2.25V ~ 3.6V
Current - supply35mA
Current - supply (Disable)22mA
Frequency50 MHz
Frequency stability±50ppm
Operating temperature-55°C~125°C
Size (Dimension)0.276\" L x 0.197\" W (7.00mm x 5.00mm)
Height - seated0.035\" (0.90mm)
OutputCMOS
PackageTube
RatingsAEC-Q100
FunctionEnable/Disable
Base resonatorMEMS
Case6-SMD, No Lead Exposed Pad

Product details

What this MEMS oscillator delivers

The DSC1121AM1-050.0000 is a 50 MHz XO (Standard) oscillator built on a MEMS resonator, outputting a CMOS clock signal. It is part of Microchip's DSC1121 series and comes in a 6-SMD, No Lead Exposed Pad package measuring 7.00mm x 5.00mm. The Enable/Disable function lets you gate the output without cycling the supply — useful for power sequencing or test modes where the clock line must be tri-stated.

AEC-Q100 qualification means the part has passed automotive-grade reliability stress tests: it is production-validated for automotive Tier-1 applications that require PPAP documentation and traceability.

Supply voltage and current draw

Operates from 2.25V to 3.6V, so it can run on a 2.5V or 3.3V rail without an extra regulator. The max supply current is 35 mA when active and 22 mA when disabled — the disable current is still present because the internal MEMS resonator and PLL remain powered.

Frequency stability and mounting

Frequency stability is ±50 ppm over the full temperature range — tight enough for most microcontroller and FPGA clock trees that do not require a TCXO or OCXO. Surface-mount package with a seated height of 0.90 mm max. The exposed pad on the 6-SMD package should be soldered to a ground plane for thermal management; the pad also provides a low-inductance return path for the high-frequency output.

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