The supply voltage spans 2.25V to 3.6V, so the same part can serve a 2.5V FPGA bank or a 3.3V microcontroller without a separate regulator.
The 6-VDFN exposed pad package measures 7.00 mm x 5.00 mm with a seated height of 0.90 mm. A single via under the pad to the ground plane is sufficient for most layouts; for high-vibration environments, add a grid of vias to improve mechanical adhesion. Surface-mount assembly follows standard reflow profiles for lead-free solder. The package is RoHS-compliant per Microchip's standard material declaration.
Availability is confirmed per RFQ through independent distribution.