MEMS XO at 41.5 MHz – ±50 ppm stability, 2.25-3.6 V supply
Package and board-fit – 6-VDFN with exposed pad
Housed in a 7.00 mm × 5.00 mm 6-VDFN package with an exposed pad, the DSC1121AE1-041.5000 requires a thermal-land pattern on the PCB — the pad should be soldered to a ground plane pour for heat sinking and mechanical stability. Seated height is 0.90 mm max, fitting standard 1.0 mm clearance profiles on dense mixed-technology boards.
