145.2 MHz HCSL clock source — MEMS, not quartz
The 6-VDFN exposed pad package (7.00 mm × 5.00 mm, 0.90 mm seated height) needs a thermal pad on the PCB for heat sinking; the exposed paddle is the primary thermal path, so the board layout should include a copper plane under the pad.
Active — no obsolescence watch needed
Listed as Active by Microchip.
