6-SMD no-lead footprint and board-fit
The DSC1101CI2-025.0000T: The no-lead (LGA-style) package has flat solder pads on the bottom — the PCB land pattern should match the manufacturer's recommended footprint (typically a 6-pad array with a central thermal pad, though the thermal pad is not electrically connected). Reflow profile follows standard lead-free solder paste for JEDEC MSL 1 parts.
