What this MEMS oscillator replaces and where it fits
Standby power-down and disable current
Package, footprint, and reflow considerations
The 6-SMD no-lead package measures 5.00 mm x 3.20 mm with a seated height of 0.90 mm max — the small footprint leaves room for passives and decoupling caps on a tight layout. No exposed paddle means no thermal-via requirement under the part. Standard JEDEC reflow profile applies — the MEMS die is plastic-encapsulated, so MSL is typically Level 1 (no bake required before reflow).