Package, footprint, and board-level reality
Housed in a 6-SMD no-lead package measuring 5.00 mm x 3.20 mm x 0.90 mm (0.197" x 0.126" x 0.035"), the DSC1101BE2-033.0000 sits flat on the PCB with no through-hole leads — the six pads are on the bottom face, so the layout needs a solder-paste stencil aperture matched to the pad geometry and a reflow profile that follows the J-STD-020 MSL level of the part. The surface-mount package is compatible with standard pick-and-place equipment and reflow soldering. No special handling beyond ESD precautions is required — the MEMS die is less sensitive to mechanical shock than a quartz blank, but the ceramic substrate still cracks under excessive board flex.