Housed in a 4-VDFN package measuring 2.50 mm x 2.00 mm with a seated height of 0.90 mm, the DSC1001DI5-041.1420T fits tight PCB real estate. The 4-pin VDFN footprint is a common MEMS oscillator layout — the same land pattern is shared across the DSC1001 family, so a single footprint covers multiple frequencies in a BOM variant. The VDFN package has no exposed pad, so thermal vias are not required — the part dissipates only 8 mA max and runs cool in normal operation.
The MEMS resonator eliminates quartz supply-chain constraints; the die is a standard Microchip CMOS process. Sourced through independent distribution channels. The DSC1001 series has broad distributor coverage, so lead times are generally short for active parts in this family.