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Microchip Technology DSC1001CL3-025.0000T — Crystals & Oscillators

DSC1001CL3-025.0000T – Microchip MEMS XO, 25 MHz, CMOS

MPNDSC1001CL3-025.0000T
Active

Microchip Technology DSC1001 series, XO (Standard) MEMS oscillator, 25 MHz CMOS output, ±20 ppm stability, 1.7V–3.6V supply, -40°C to 105°C, AEC-Q100, 4-VDFN package, Tape & Reel

Microchip Technology DSC1001CL3-025.0000T datasheet (PDF)
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

DSC1001CL3-025.0000T specifications
ParameterValue
TypeXO (Standard)
SeriesDSC1001
MountingSurface Mount
Supply voltage1.7V ~ 3.6V
Current - supply8mA
Current - supply (Disable)15µA
Frequency25 MHz
Frequency stability±20ppm
Operating temperature-40°C~105°C
Size (Dimension)0.126\" L x 0.098\" W (3.20mm x 2.50mm)
Height - seated0.035\" (0.90mm)
OutputCMOS
PackageTape & Reel (TR)
RatingsAEC-Q100
FunctionStandby (Power Down)
Base resonatorMEMS
Case4-VDFN

Product details

The MEMS resonator gives it better shock and vibration tolerance than a quartz-based XO, and the 1.7V to 3.6V supply range lets it run from either a 1.8V or 3.3V rail without a level translator.

Package and board-fit for 4-VDFN

Housed in a 4-VDFN package measuring 3.20 mm x 2.50 mm with a seated height of 0.90 mm max, the DSC1001CL3-025.0000T fits tight-profile automotive ECU layouts and shares the same footprint as many standard 4-pin oscillators. Surface-mount, supplied on Tape & Reel — the 4-VDFN has no exposed thermal pad, so the standard 4-pin layout with a ground pour under the package is sufficient for decoupling.

Frequently asked questions

How can I order the DSC1001CL3-025.0000T or request a quote?

This is an active-production part from Microchip. Submit an RFQ with your target quantity; we source through independent distribution and confirm availability and pricing at quote time. No stock-holding claim is made on this page.

Does the DSC1001CL3-025.0000T meet AEC-Q100 automotive qualification?

That qualifies it for under-hood and cabin-ambient automotive applications.

What is the recommended PCB footprint for the 4-VDFN package?

The 4-VDFN package is 3.20 mm x 2.50 mm with a 0.90 mm seated height. A standard 4-pad layout with a ground pour under the package (no thermal pad) is sufficient. Follow Microchip's recommended land pattern in the DSC1001 datasheet for pad dimensions and keep-out zones.