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Microchip Technology DSC1001CL1-037.1250T — Crystals & Oscillators

DSC1001CL1-037.1250T Microchip MEMS XO 37.125 MHz CMOS

MPNDSC1001CL1-037.1250T
Active

Microchip DSC1001CL1-037.1250T, MEMS-based XO (Standard), 37.125 MHz, CMOS output, ±50 ppm stability, 1.8V–3.3V supply, AEC-Q100, -40 to 105°C, 4-SMD package.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

DSC1001CL1-037.1250T specifications
ParameterValue
TypeXO (Standard)
SeriesDSC1001
MountingSurface Mount
Voltage1.8V ~ 3.3V
Current - supply7.2mA
Current - supply (Disable)15µA
Frequency37.125 MHz
Frequency stability±50ppm
Operating temperature-40°C~105°C
Size (Dimension)0.126\" L x 0.098\" W (3.20mm x 2.50mm)
Height - seated0.035\" (0.90mm)
OutputCMOS
PackageTape & Reel (TR)
RatingsAEC-Q100
FunctionStandby (Power Down)
Base resonatorMEMS
Case4-SMD, No Lead

Product details

The DSC1001CL1-037.1250T is a MEMS-based XO (Standard) that outputs a fixed 37.125 MHz CMOS clock from a 1.8V to 3.3V supply rail.

Power-down standby and supply flexibility

When active, the oscillator draws 7.2 mA max at the rated frequency, which keeps the thermal contribution on a densely populated PCB manageable. The 1.8V–3.3V supply range means the same part can run from a 1.8V core rail, a 2.5V I/O bank, or a 3.3V peripheral bus without a separate level translator or a second oscillator variant on the BOM.

Housed in a 4-SMD, No Lead package measuring 3.20 mm x 2.50 mm with a seated height of 0.90 mm, the DSC1001CL1-037.1250T fits the standard 3.2 x 2.5 mm oscillator footprint used across the DSC1001 family. The 0.90 mm profile keeps it below the height clearance of a mezzanine card or a sealed enclosure lid.

Frequently asked questions

What is the frequency of the DSC1001CL1-037.1250T?

The oscillator outputs a fixed 37.125 MHz CMOS clock.

Is the DSC1001CL1-037.1250T suitable for automotive applications?

Yes — it is AEC-Q100 qualified and rated for -40 to 105°C, which covers under-hood and cabin environments where thermal cycling and vibration are present.