4-SMD, No Lead package, 3.20 mm x 2.50 mm footprint, 0.90 mm seated height. No leads to bend — the part sits flat on the pad and reflows with a standard SMT profile. The MEMS die is encapsulated; no quartz blank to crack under thermal shock. If you need to lift it, hot air at 260 °C for 20 seconds is enough; the pad layout is forgiving for hand rework.

DSC1001CI5-037.1250 – Microchip MEMS XO, 37.125 MHz
MPNDSC1001CI5-037.1250
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Microchip DSC1001 series MEMS XO, 37.125 MHz, CMOS output, ±10 ppm stability, AEC-Q100 automotive qualified, surface-mount 4-SMD package.
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026
Specifications
| Parameter | Value |
|---|---|
| Type | XO (Standard) |
| Series | DSC1001 |
| Mounting | Surface Mount |
| Supply voltage | 1.8V ~ 3.3V |
| Current - supply | 7.2mA |
| Current - supply (Disable) | 15µA |
| Frequency | 37.125 MHz |
| Frequency stability | ±10ppm |
| Operating temperature | -40°C~85°C |
| Size (Dimension) | 0.126\" L x 0.098\" W (3.20mm x 2.50mm) |
| Height - seated | 0.035\" (0.90mm) |
| Output | CMOS |
| Package | Tube |
| Ratings | AEC-Q100 |
| Function | Standby (Power Down) |
| Base resonator | MEMS |
| Case | 4-SMD, No Lead |
Product details
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