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Microchip Technology DSC1001CE2-001.8432 — Crystals & Oscillators

DSC1001CE2-001.8432 MEMS XO 1.8432 MHz CMOS AEC-Q100 Active

MPNDSC1001CE2-001.8432
Active

Microchip DSC1001 series MEMS XO, 1.8432 MHz fixed frequency, CMOS output, ±25 ppm stability, 1.8V–3.3V supply, AEC-Q100 automotive qualified, 4-SMD no-lead package.

Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

DSC1001CE2-001.8432 specifications
ParameterValue
TypeXO (Standard)
SeriesDSC1001
MountingSurface Mount
Voltage1.8V ~ 3.3V
Current - supply6.3mA
Current - supply (Disable)15µA
Frequency1.8432 MHz
Frequency stability±25ppm
Operating temperature-20°C~70°C
Size (Dimension)0.126\" L x 0.098\" W (3.20mm x 2.50mm)
Height - seated0.035\" (0.90mm)
OutputCMOS
PackageTray
RatingsAEC-Q100
FunctionStandby (Power Down)
Base resonatorMEMS
Case4-SMD, No Lead

Product details

The DSC1001CE2-001.8432 is a fixed-frequency MEMS oscillator delivering 1.8432 MHz CMOS output — a common clock frequency for CAN controllers, UART baud-rate generation, and low-speed MCU cores. The MEMS resonator eliminates the quartz crystal start-up time and fragility, and the 4-SMD no-lead package (3.20 mm x 2.50 mm) fits a standard XO footprint without layout changes. Supply voltage spans 1.8V to 3.3V, so the same order code serves 3.3V and 1.8V logic domains without a separate regulator or a different frequency variant.

AEC-Q100 Grade and temperature range

The AEC-Q100 qualification covers the stress and reliability tests required for automotive electronics — the oscillator can be placed on an engine-control or body-controller PCB that sees production-level thermal cycling and vibration.

Frequently asked questions

Can DSC1001CE2-001.8432 replace DSC1001CE2-001.8432T?

The suffix 'T' typically denotes a different packaging option (tape-and-reel vs. tray) from the same base part. The electrical characteristics — frequency, output, supply range, stability — are identical. Confirm the reel quantity and package orientation match your pick-and-place setup; the silicon and MEMS die are the same.