Standby function and supply-voltage flexibility
Package and board-layout fit
Housed in a 4-SMD, No Lead Exposed Pad package measuring 7.00 mm x 5.00 mm with a seated height of 0.90 mm max — the exposed pad requires a thermal-via pattern under the package to sink heat from the MEMS die and maintain frequency stability under high ambient temperature. The 0.90 mm height profile fits standard 1.6 mm PCB stack-ups with clearance for conformal coating in the engine bay.
