The standby pin is active-low — pulling it low shuts the output into high-Z, so the downstream clock tree sees a clean stop, not a runt pulse.
4-SMD no-lead exposed-pad package, 7.00 mm x 5.00 mm footprint, 0.90 mm seated height — the exposed pad underneath is the thermal path; a small via array under the pad pulls heat into the ground plane and keeps the MEMS die within spec during reflow. The pad is solder-mask-defined — the rework tech wants a stencil that deposits enough paste on the centre pad without bridging the perimeter pads. A hot-air profile at 260°C peak, 30 seconds above liquidus, lifts the part clean without lifting the pad.