Supply flexibility and power-down control
Operating from 1.8V to 3.3V, this oscillator works across common logic rails without a separate level translator — the same BOM position can serve 1.8V MCUs or 3.3V FPGAs.
Housed in a 4-SMD, No Lead Exposed Pad package (7.00mm x 5.00mm, 0.90mm seated height), the part has a large thermal pad underneath — ensure the PCB has a corresponding solder paste aperture to avoid tombstoning during reflow. The exposed pad aids heat dissipation but also means the pad must be properly soldered; a hot-air rework station at 260°C (peak) with a fine nozzle works — will it survive the hot air? Yes, if the profile stays within JEDEC MSL limits.