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Microchip Technology ATMEGA88PA-MU — Microcontrollers & Processors (MCU / MPU / DSP)

ATMEGA88PA-MU AVR 8-bit MCU, 8KB Flash, 20MHz, 32-VQFN

MPNATMEGA88PA-MU
Active

Microchip AVR® ATmega series, ATMEGA88PA-MU, 8-bit MCU, 20MHz, 8KB Flash, 1K x 8 SRAM, 512 x 8 EEPROM, 23 I/O, I²C/SPI/UART, 1.8V-5.5V, -40°C to 85°C, 32-VFQFN Exposed Pad, Tray.

$1.7300Ref. price · indicative, final on quote
Packaging32-VFQFN Exposed Pad
RoHSROHS3 Compliant
SeriesAVR® ATmega
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

ATMEGA88PA-MU specifications
ParameterValue
SeriesAVR® ATmega
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.8V ~ 5.5V
Operating temperature-40°C ~ 85°C (TA)
Speed20MHz
PackageTray
RAM size1K x 8
Core size8-Bit
EEPROM size512 x 8
PeripheralsBrown-out Detect/Reset, POR, PWM, WDT
ConnectivityI²C, SPI, UART/USART
Number of i (O)23
Core processorAVR
Case32-VFQFN Exposed Pad
Data convertersA/D 8x10b
Program memory size8KB (4K x 16)

Product details

8-bit AVR with 8 KB Flash in a 5x5 mm QFN

The Microchip ATMEGA88PA-MU is an 8-bit AVR microcontroller from the ATmega family, packing 8 KB of Flash program memory, 1 KB SRAM, and 512 bytes of EEPROM in a 32-VQFN package measuring 5x5 mm.

23 I/O and peripheral set for board-level integration

On-chip peripherals include an 8-channel 10-bit ADC, brown-out detect, power-on reset, PWM channels, and a watchdog timer.

Industrial temperature grade and active lifecycle

RoHS3 compliant.

32-VQFN package — footprint and storage notes

Housed in a 32-VFQFN with exposed pad (supplier package 32-VQFN, 5x5 mm), this is a surface-mount device.

Frequently asked questions

What is the difference between ATMEGA88PA-MU and ATMEGA88PA-AU?

The only difference is the package: the -MU suffix is a 32-VQFN (5x5 mm, exposed pad), while the -AU suffix is a 32-TQFP (7x7 mm, gull-wing leads). Die, memory, peripherals, and electrical specs are identical — the choice is board area vs. rework ease.