Microchip AVR® ATmega series, ATMEGA324PA-PU, 8-bit MCU, 20MHz, 32KB Flash, 2K x 8 SRAM, 1K x 8 EEPROM, I²C/SPI/UART, 32 I/O, 8x10b ADC, 1.8V–5.5V, -40°C to 85°C, 40-PDIP.
| Parameter | Value |
|---|---|
| Series | AVR® ATmega |
| Mounting | Through Hole |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.8V ~ 5.5V |
| Operating temperature | -40°C~85°C(TA) |
| Speed | 20MHz |
| Package | Tube |
| RAM size | 2K x 8 |
| Core size | 8-Bit |
| EEPROM size | 1K x 8 |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT |
| Connectivity | I²C, SPI, UART/USART |
| Number of i (O) | 32 |
| Core processor | AVR |
| Case | 40-DIP (0.600\", 15.24mm) |
| Data converters | A/D 8x10b |
| Program memory size | 32KB (16K x 16) |
The 1 KB EEPROM provides non-volatile storage for calibration constants or configuration parameters without wearing the Flash. On-chip peripherals include brown-out detection, a programmable watchdog timer, and multiple PWM channels.
The primary difference is the package: the ATMEGA324PA-PU comes in a 40-pin PDIP (through-hole) package, while the ATMEGA324P-AU is in a 44-pin TQFP (surface-mount) package. The core, memory, and peripheral sets are functionally the same. The choice depends on the assembly process — through-hole for prototyping or low-volume hand-solder builds, surface-mount for automated reflow production.