10 ns EE PLD in a hermetic 28-CLCC — the high-reliability glue-logic choice
The Microchip ATF22V10B-10NM/883 is a 22V10-architecture EE PLD with a 10 ns propagation delay, 10 macrocells, and a 5V supply rail, housed in a 28-CLCC hermetic ceramic package. This is the MIL-grade variant — the /883 suffix signals screening and qualification for defence, aerospace, and other high-reliability environments where a plastic LQFP or TQFP will not meet the reliability budget.
10 ns — timing margin for fast buses
The 10 ns propagation delay (tPD) sets the window from input transition to valid output. In a 5V system, the 10 ns PLD timing must be summed with memory access and board trace delays to verify setup/hold.
Hermetic 28-CLCC — sealed for the harsh environment
The 28-CLCC (11.45x11.45 mm) is a ceramic leadless chip carrier with a sealed cavity. Unlike plastic packages, the CLCC does not absorb moisture, and the coefficient of thermal expansion matches alumina substrates and ceramic PCBs. This package is the standard choice for avionics, satellite, and downhole instrumentation where the board sees rapid thermal cycling, high humidity, or vacuum. The surface-mount footprint is the same as a standard 28-PLCC, but the ceramic body and lid are not rework-friendly — the lid seal can crack if the part is desoldered with a hot-air profile that exceeds 260 °C for more than 10 seconds.