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Microchip Technology ATF22V10B-10GM/883 — FPGA / CPLD & Programmable Logic

ATF22V10B-10GM/883 EE PLD, 10 ns, 24-CDIP, Active

MPNATF22V10B-10GM/883
Active

Microchip ATF22V10B-10GM/883, 22V10 series EE PLD, 10 ns speed, 10 macrocells, 5V supply, 24-CDIP (0.300", 7.62mm) through-hole package, active lifecycle.

$96.5000Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

ATF22V10B-10GM/883 specifications
ParameterValue
Series22V10
MountingThrough Hole
Programmable typeEE PLD
Voltage - input5V
Speed10 ns
PackageTube
Case24-CDIP (0.300\", 7.62mm)
Number of macrocells10

Product details

The Microchip ATF22V10B-10GM/883 is an electrically erasable programmable logic device from the industry-standard 22V10 architecture, offering a 10 ns propagation delay across 10 macrocells. This is the /883 variant, indicating processing and screening for military and high-reliability applications — the ceramic package and extended temperature range suit it for avionics, missile guidance, satellite subsystems, and downhole instrumentation where plastic-packaged PLDs would not survive the environment.

10 ns speed grade — timing budget for address decode and state machines

The 10 ns propagation delay (tPD) is the time from input through the AND-OR array to a registered or combinatorial output. In a typical address decoding application feeding a memory chip select, that 10 ns eats into the total access-time budget — a 70 ns SRAM with a 10 ns decode leaves 60 ns for the memory itself. For state-machine clocking, the 10 ns tPD sets a ceiling on how fast you can sequence through states before the registered outputs settle. The 22V10 architecture gives you 10 macrocells that can be individually configured as registered or combinatorial, which is enough for medium-complexity glue logic without cascading multiple devices.

Ceramic DIP — assembly and reliability considerations

The 24-CDIP package (0.300-inch body, 7.62 mm row spacing) is a through-hole ceramic dual-in-line with hermetic sealing. Unlike plastic DIPs, the ceramic body does not absorb moisture, so no bake-out is needed before soldering. The lead frame is typically Kovar with gold plating — compatible with hand-soldering, wave-soldering, or socket insertion. For a PCB layout, the 0.100-inch pin pitch and 0.300-inch row spacing match standard DIP footprints; the hole diameter should accommodate the 0.018-inch nominal lead width with adequate annular ring. The ceramic package also handles higher operating temperatures than plastic — relevant for the /883 temperature grade.

For a sustaining BOM that already qualifies this part, there is no urgency to find a drop-in replacement or stockpile inventory.

Frequently asked questions

What is the cross reference for ATF22V10B-10GM/883?

The ATF22V10B-10GM/883 is the Microchip (formerly Atmel) /883-grade version of the 22V10 architecture. Pin-compatible equivalents from other manufacturers include the Lattice GAL22V10B and the Cypress (now Infineon) PALCE22V10, both in 24-pin DIP packages. However, the /883 screening and ceramic package are specific to this variant — plastic DIP equivalents do not carry the same military temperature range or hermetic seal. Verify the speed grade and temperature range against your BOM requirement before substituting.