Package and compliance snapshot
The ATECC608B-SSHDA-B: Supplier device package is 8-SOIC; the 0.154" (3.90mm) body width is the narrow SOIC variant, so the PCB land pattern should match the JEDEC MS-012 variation for 1.27mm pitch. No exposed pad — standard SOIC thermal relief on the copper pour is sufficient for the die's dissipation. RoHS status is ROHS3 Compliant, covering all six original substances plus the four phthalates under EU 2015/863.