81-CSP (5x5) — footprint and board integration
The AGLN250V5-CSG81I is a Microchip IGLOO nano FPGA in an 81-ball CSP (5x5 mm) package. The 0.5 mm ball pitch demands a controlled-impedance PCB with via-in-pad or microvia fan-out for the inner rows — a standard 4-layer board with 0.2 mm trace/space handles it, but the outer two rows break out on the top layer without blind vias. The 60 I/O are distributed across the ball map; the CSP's low 0.9 mm seated height suits compact, vibration-tolerant assemblies in handheld or embedded modules.
The single 1.425 V to 1.575 V core supply simplifies the power tree — no separate VCCIO rail for the I/O banks (they share the same 1.5 V nominal). The 1.5 V tolerance means a standard 1.5 V LDO or a 1.8 V rail stepped down through a 0.3 V dropout regulator works, provided the output stays inside the 150 mV window. The 100°C TJ ceiling limits the ambient to about 85°C in still air with the CSP's 40°C/W theta-JA — a small heatsink or forced airflow buys margin for the upper end.
250K gates, 6144 cells — logic capacity for glue and control
With 250,000 system gates and 6144 logic elements, the AGLN250V5-CSG81I fits medium-density glue logic: address decoding, state machines, I/O expansion, or a small microcontroller wrapper. The 36 Kbit (36864 bits) of embedded SRAM supports a single 18 Kbit dual-port block or two 9 Kbit FIFOs — enough for a 256-byte packet buffer or a coefficient lookup table. The 60 user I/O, each configurable as LVCMOS 1.5/1.8/2.5/3.3 V, connect directly to common peripheral buses (SPI, I2C, UART) without external level shifters, as long as the VCCIO matches the interface voltage.