30K-gate ProASIC3 FPGA in a 48-QFN package
The A3P030-1QNG48 is a Microchip ProASIC3 FPGA packing 30,000 gates in a 48-VFQFN exposed-pad package (6x6 mm). With 34 user I/O and a 1.425 V to 1.575 V core supply, it fits as a glue-logic bridge or low-density controller on a mixed-signal board where a CPLD runs out of registers but a full-scale FPGA is overkill.
Logic density and I/O count
30,000 system gates give you roughly 750 to 1,000 usable logic tiles after synthesis overhead — enough for a state machine with a dozen counters, a simple SPI or I2C bridge, and some address decoding. The 34 I/O are all user-configurable; with the 48-QFN package, every pad on the perimeter is a signal pin, so no I/O is wasted on power or ground (those go through the exposed pad and dedicated VDD/VSS rings). The core voltage window is tight — 1.425 V to 1.575 V — which means the 1.5 V rail on your board must stay within ±5 %; a 1.8 V LDO feeding this part needs a post-regulator divider or a dedicated 1.5 V supply. The I/O banks tolerate 3.3 V and 2.5 V standards, so the FPGA can talk directly to a legacy 3.3 V peripheral without external level shifters.
Temperature grade and operating envelope
It will run in a ventilated enclosure or on a board with moderate self-heating, but not in an engine bay or outdoor pole-mount without active cooling. The 48-QFN with exposed pad relies on the PCB copper pour for heat spreading; a 4-layer board with thermal vias under the pad keeps the junction below 85°C at full I/O toggle.