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Microchip Technology 25LC010A-I/MS — Discrete Semiconductors

Microchip 25LC010A-I/MS EEPROM, 1Kbit SPI 10MHz 8-MSOP

MPN25LC010A-I/MS
End of Life

Microchip Technology 25LC010A-I/MS EEPROM, 1Kbit, SPI, 10 MHz, 2.5-5.5V, -40°C to 85°C, 8-MSOP, Tube.

$0.54Ref. price · indicative, final on quote
Packaging8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
StockIn Stock (16)
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

25LC010A-I/MS Technical Specifications
ParameterValue
Memory typeNon-Volatile
Mounting typeSurface Mount
Voltage2.5V ~ 5.5V
Frequency10 MHz
Memory interfaceSPI
Operating temperature-40°C ~ 85°C (TA)
PackageTube
TechnologyEEPROM
Memory size1Kbit
Memory formatEEPROM
Case8-TSSOP, 8-MSOP (0.118\", 3.00mm Width)
Memory organization128 x 8
Write cycle time - word, page5ms

Product details

1Kbit SPI EEPROM — 10 MHz clock, 2.5-5.5V supply, industrial temp range

The Microchip 25LC010A-I/MS is a 1Kbit serial EEPROM with an SPI interface, organized as 128 x 8 bits.

Supplied in an 8-MSOP package (3.00 mm width, 0.118" body), surface-mount. The supplier device package is 8-MSOP — the same footprint as the industry-standard 8-lead MSOP. Tube packaging is the default; if your pick-and-place prefers tape-and-reel, confirm the ordering suffix at RFQ.

Frequently asked questions

What is the closest functional second-source for 25LC010A-I/MS?

The AT24C08D-SSHM-B is a common 8Kbit EEPROM but uses an I²C interface, not SPI. The 25LC010A-I/MS is a 1Kbit SPI device — the interface protocol is different, so a direct drop-in replacement without firmware changes is not possible. For an SPI EEPROM alternative, look at other 25LCxxx series parts from Microchip with matching density and package.