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Microchip Technology 1N6633US — Discrete Semiconductors

Microchip 1N6633US Zener Diode, 3.6 V, 5 W, E-MELF

MPN1N6633US
Active

Microchip Technology 1N6633US Zener diode, 3.6 V nominal, 5 W, ±5% tolerance, E-MELF surface mount, D-5B package.

$21.2700Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

1N6633US specifications
ParameterValue
MountingSurface Mount
Voltage - zener (Nom)3.6 V
Voltage - forward (Vf) (Max) @ if1.5 V @ 1 A
Current - reverse leakage @ vr250 µA @ 1 V
Power - max5 W
Operating temperature-65°C~175°C
PackageBulk
Tolerance±5%
CaseE-MELF
Impedance (Max)500 Ohms

Product details

3.6 V rail clamp or reference in a hermetic surface-mount package

The 1N6633US is a 3.6 V Zener diode rated for 5 W continuous dissipation in the E-MELF (D-5B) hermetic surface-mount package. The 3.6 V nominal breakdown at ±5% tolerance sets the regulation window for a low-voltage rail clamp or shunt reference, while the 5 W power rating means the junction-to-solder thermal path through the E-MELF end-cap terminations must carry the full dissipation — the copper pad area on the board sets the real-world derating.

Reverse leakage and forward drop — the bias-circuit checkpoints

Reverse leakage is 250 µA maximum at 1 V reverse — well below the Zener knee, so a bias resistor string that holds the diode at 1 V sees negligible current draw. Forward voltage is 1.5 V maximum at 1 A, which matters if the diode sees surge current in the forward direction during a reverse-polarity event. Maximum Zener impedance (Zzt) is 500 Ohms at the test current; this sets the dynamic resistance the downstream circuit sees as the Zener regulates. A 500-Ohm impedance at 3.6 V means the output shifts about 0.5 V per mA of load change — adequate for a clamp or a low-accuracy reference, but not for a precision bias rail.

Frequently asked questions

What is the tolerance and power rating of the 1N6633US?

The Zener voltage tolerance is ±5%, and the continuous power dissipation is 5 W. The 5 W rating assumes adequate board-level thermal management; the E-MELF package relies on the solder joint and copper pad area to sink heat.