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Microchip Technology 1N6622US — Discrete Semiconductors

Microchip 1N6622US Fast Recovery Diode, 660V, 1.2A, 30ns

MPN1N6622US
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Microchip Technology 1N6622US fast recovery rectifier diode, 660 V, 1.2 A, 30 ns trr, SQ-MELF A package, surface mount.

$8.3400Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

1N6622US specifications
ParameterValue
Diode typeStandard
MountingSurface Mount
Voltage - DC reverse (Vr)660 V
Voltage - forward (Vf) (Max) @ if1.4 V @ 1.2 A
Current - reverse leakage @ vr500 nA @ 660 V
Current - average rectified1.2A
Operating temperature - junction-65°C~150°C
SpeedFast Recovery =< 500ns, > 200mA (Io)
PackageBulk
CaseSQ-MELF, A
Capacitance @ vr,10pF @ 10V, 1MHz
Reverse recovery time30 ns

Product details

Fast-recovery rectifier for high-voltage switching supplies

The Microchip Technology 1N6622US is a standard fast-recovery rectifier diode rated for 660 V DC reverse voltage and 1.2 A average forward current, with a reverse recovery time of 30 ns. This trr places it in the Fast Recovery class (≤500 ns, >200 mA), making it suitable for high-frequency rectification in flyback and forward-converter secondary stages where switching losses matter. Forward voltage is 1.4 V max at 1.2 A, and reverse leakage is only 500 nA at 660 V — the leakage floor stays low enough that self-heating at high line voltage is minimal in a well-laid-out board. The 10 pF capacitance at 10 V, 1 MHz is low enough to avoid significant capacitive coupling in snubber or clamp circuits.

SQ-MELF package — hermetic surface-mount for harsh environments

Housed in an SQ-MELF (A-MELF) surface-mount package, the 1N6622US offers a hermetic ceramic-to-metal seal. This package is standard for high-reliability applications where moisture resistance and thermal cycling endurance are critical — avionics power supplies, downhole instrumentation, and satellite bus converters routinely specify MELF diodes for their solder-joint fatigue life under vibration. The A-MELF footprint is cylindrical with metallized end caps — board layout must account for the barrel geometry to avoid tombstoning during reflow. The package is compatible with standard solder paste stencil apertures for 0.5 mm to 0.8 mm thick boards.

Frequently asked questions

What is the reverse recovery time of the 1N6622US?

The 1N6622US has a reverse recovery time (trr) of 30 ns, which qualifies it as a Fast Recovery diode (≤500 ns, >200 mA). This speed suits it for switching power supplies operating in the 50–200 kHz range.

What package does the 1N6622US come in?

The 1N6622US is supplied in an SQ-MELF, A package (also referred to as A-MELF). It is a surface-mount, hermetic ceramic package suitable for high-reliability and harsh-environment applications.